technical data 4122 product description ? compact footprint ? designed for high density, high current/low voltage applications ? foil technology that adds higher reliability factor over the traditional magnet wire used for higher frequency circuit designs ? inductance range from 0.50uh to 6.52uh ? current range from 30 to 120 amps ? ferrite core material applications ? distributed power systems dc-dc converters ? general-purpose low voltage supplies ? computer systems ? servers ? point of load (pol) converters ? industrial equipment environmental data ? storage temperature range (component): -40c to +125c ? operating temperature range: -40c to +125c (ambient plus self-temperature rise) ? solder reflow temperature: j-std-020d compli - ant. packaging ? supplied in bulk packaging, 24 parts per tray hc3 high current power inductors pb effective february 2017 supersedes october 2015
2 technical data 4122 effective february 2017 hc3 high current power inductors product specifications part number 5 ocl 1 (h) 20% l rms 2 (amps) l sat 3 (amps) dcr (m ) maximum @ 20c volt-sec 4 (v-s) ref. hc3-r50-r 0.50 78.00 120 0.42 17.33 hc3-1r0-r 1.05 78.00 78 0.42 17.33 HC3-2R2-R 2.05 55.50 60 0.70 26.01 hc3-3r3-r 3.63 42.45 46 1.20 34.65 hc3-4r7-r 4.98 33.80 38 2.17 43.30 hc3-5r6-r 5.68 33.80 34.5 2.17 43.30 hc3-6r0-r 6.52 33.80 30.0 2.17 43.30 1. ocl (open circuit inductance) test parameters: 300khz, .25vrms, 0.0adc & isat. 2. dc current for approximately ? t of 40c without core loss de-rating is necessary for ac currents. pcb layout, trace thickness and width, air fow and proximity of other heat generating components will affect temperature rise. it is recommended that the temperature of the part not exceed 125c under worst case conditions verifed in the end application. 3. peak current for approximately 30% rolloff (@20c). 4. applied volt-time product (v-s) across the inductor. this value represents the applied v-s at 300khz necessary to generate a core loss equal to 10% of the total losses for a 40c temperature rise. 5. part number defnition - hc3-xxx-r: hc3 = product code and size -xxx = inductance value r = decimal point (if no r is present, last character equals number of zeros ) -r suffx = rohs compliant dimensionsCmm part number height max hc3-r50-r 18.0 hc3-1r0-r 17.5 HC3-2R2-R 17.5 hc3-3r3-r 17.5 hc3-4r7-r 17.5 hc3-5r6-r 17.5 hc3-6r0-r 17.5 1 2 hc3-xxx wwl lyy r 14 .5 ty p 25 .3 ma x 30 .0 ma x 22 .0 19 .0 5. 50 5. 50 3.0 ty p 4.0 ty p ht ma x top view recommended pcb pad layout front view schemati c part marking: hc3-xxx (-xxx= inductance value, r= decimal point, if no r is present then last character equals number of zeros) wwllyy= date code, r= revision level www.eaton.com/electronics
3 technical data 4122 effective february 2017 hc3 high current power inductors inductance characteristics core loss ir ms de ra ti ng wi th co re loss fo r hc 3 30 40 50 60 70 80 90 10 0 10 30 50 70 90 11 01 30 150 1701 90 %a pp li ed vo lt -u seconds %of irms specified from zero ripple application 100k hz 200k hz 300k hz 400k hz 500k hz oc l vs is at 0 10 20 30 40 50 60 70 80 90 100 01 02 03 04 05 06 07 08 09 01 00 1101 20 130 %o f is at %o fo cl www.eaton.com/electronics
hc3 high current power inductors technical data 4122 effective february 2017 temperature t t p t s t c -5c ti me 25 c to pe ak ti me 25 c t sm in t sm ax t l t p prehea t a ma x. ra mp up ra te = 3 c/ s ma x. ra mp do wn ra te = 6 c/ s solder reflow profile reference jdec j-std-020d profile feature standard snpb solder lead (pb) free solder preheat and soak ? temperature min. (t smin ) 100c 150c ? temperature max. (t smax ) 150c 200c ? time (t smin to t smax ) (t s ) 60-120 seconds 60-120 seconds average ramp up rate t smax to t p 3c/ second max. 3c/ second max. liquidous temperature (t l l * tolerance for peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. ** tolerance for time at peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. table 1 - standard snpb solder (t c ) package thickness volume mm3 <350 volume mm3 350 <2.5mm) 235c 220c 2.5mm 220c 220c table 2 - lead (pb) free solder (t c ) package thickness volume mm 3 <350 volume mm 3 350 - 2000 volume mm 3 >2000 <1.6mm 260c 260c 260c 1.6 C 2.5mm 260c 250c 245c >2.5mm 250c 245c 245c eaton electronics division 1000 eaton boulevard cleveland, oh 44122 united states www.eaton.com/electronics ? 2017 eaton all rights reserved printed in usa publication no. 4122 february 2017 eaton is a registered trademark. all other trademarks are property of their respective owners. life support policy: eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an offcer of the company. life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in signifcant injur y to the user. eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribu tion of any products. eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin.
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